Operational Defect Database
BugZero found this defect 18 days ago.
Data sources
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Hewlett Packard Enterprise | a00139126en_us
Advisory: HPE Cray Slingshot QSFP-DD Metal Thermal Bridge Wedged in Switch Jack
Last update date:
5/2/2024
Affected products:
HPE Slingshot for HPC Clusters
HPE Cray Supercomputing EX
Affected releases:
No affected releases provided.
Fixed releases:
No fixed releases provided.
Description:
Info
On rare occasions a metal laminate piece of the QSFP-DD thermal bridge loosens and becomes wedged into the switch jack. Figure 1: Piece of Laminate Lodged in Switch Jack Figure 2: Thermal Laminate Bridge Piece
Scope
Hardware products affected: All HPE Slingshot switches
Resolution
To prevent this from occurring always ensure the following: Do not insert the cable connector (headshell) at an angle into the switch jack. Before plugging in a cable inspect the switch jack for debris and other damage. Use a flashlight as needed. Do not plug any cables into the jack if you find any debris or damage. Before plugging in a cable inspect the cable headshell and the connector for debris or damage. Do not use the cable if you find any debris or damage. Proper cable insertion: Grasp the cable by the lower part of the connector between your thumb and index finger. Hold the cable connector perpendicular to the ports panel, and gently push the connector into the port cage. Proper cable extraction: For a transceiver with integrated cable and pull-tab, grasp the pull-tab and pull it firmly, but gently. Pull outwards perpendicular until the transceiver is released from the port cage. Slide the transceiver and cable from the port. Replace the HPE Slingshot switch when this condition is found. Even if the metal laminate piece can be removed and there is no visible damage to the connector a switch replacement is required due to: If one laminate piece is missing the others will become loose. If the QSFP-DD is no longer sufficiently cooled, elevated temperature will lead to early component failure of the cable. Elevate a case to Engineering Resolution for guidance as needed.
